Biosensors & Bioelectronics

Biography

Biography: Jason M Kulick

Abstract

Microelectronics play an increasing role in biomedical technology and healthcare delivery and data collection. System optimization for decreased size and power are critical for continued adoption of such technologies, and advanced packaging of microelectronic circuits and sensors will play an expanding role in the ability of patients and healthcare providers to unobtrusively utilize new electronics systems. The semiconductor industry has generally been focused on relatively straightforward integration of similar materials and processes to achieve cost benefits and performance increases.Traditionally, this integration has been microelectronics packaging in the form of wirebonds, bumping, or more recently chip stacking with TSV (Through-Silicon-Via). However, these approaches leaves much to be desired for the integration of disparate materials, process technologies and sensor systems requiring low latency, wide bandwidth and various substrate materials. An alternative to these approaches is “Quilt Packaging” interconnect technology, which delivers monolithic-like electrical performance and enabling sub-micron chip-to-chip alignment accuracy. Quilt Packaging is currently being developed for multiple applications in biomedical applications, specifically MEMs sensors and optical systems integration.